High performance Test Socket

Z-Axis offers a wide range of high performance test sockets, which are based on our elastomeric matrix connectors, for wide range of IC packages (BGA sockets, LGA sockets, etc.), coaxical, and wafer level; and for testing high speed, digital, analog, and RF signals etc. 

Depending on board layouts and compressed height, these sockets and test fixtures can achieve high numbers of mate/de-mate cycles.

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Test Socket Schematic diagram for BGA component

socket tester circuit diagram

  1. Top Plate - Top and bottom plates to support the structure and handle the compression forces applied during testing.
  2. Customer Board - Test circuitry, printed circuit board (PCB) to which the BGA component needs to connect in order to be tested.
  3. Elastomeric - Matrix type elastomeric connector.
  4. Ball guide - which aligns the DUT to be accurately positioned against the contact pads on the test board.
  5. Dut - Device under test (DUT) in a BGA packaging.
  6. Compression plate - Pressure plate for even distribution of the compression force over the DUT to be uniform at all connections points.

Strain / Stress Analysis

Effort Analysis

One of the strengths of Z-Axis technolgy is the ability to perform stress/strain analysis to systems design by us.

In this study case, a force analysis is performed to calculate deflection of a frame of a test socket, to make sure that the compressive forces exerted on the frame bend it in the allowed range, maintaining the compression forces uniform throughout the component in order to maintain proper electrical connectivity.

Test Socket BGA component high performance test socket