High performance Test Socket

Z-Axis provides high-performance Interposer test sockets, using ematrix lastomeric connectors, for IC packages (BGA, LGA, etc), coaxial, and wafer-level testing of high-speed digital, analog, and RF signals.

Designed for integration and flexible testing of all types of DUTs (Devices Under Test) and SOMs (Systems on Module) that combine CPU, memory, and I/O functions

Depending on board layouts and compressed height, these sockets and test fixtures can achieve high numbers of mate/de-mate cycles while maintaining signal integrity and connection reliability.

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Test Socket Schematic diagram for BGA component

socket tester circuit diagram

  1. Top Plate - Top and bottom plates to support the structure and handle the compression forces applied during testing.
  2. Customer Board - Test circuitry, printed circuit board (PCB) to which the BGA component needs to connect to be tested.
  3. Elastomeric - Interposer Matrix type elastomeric connector.
  4. Ball guide - which aligns the DUT to be accurately positioned against the contact pads on the test board.
  5. DUT/ SOM - Device Under Test (DUT) or System On Module (SOM) in a BGA packaging.
  6. Compression plate - Pressure plate for even distribution of the compression force over the DUT to be uniform at all connection points.

Strain / Stress Analysis

Effort Analysis

One of the strengths of Z-Axis technolgy is the ability to perform stress/strain analysis to systems design by us.

In this study case, a force analysis is performed to calculate deflection of a frame of a test socket, to make sure that the compressive forces exerted on the frame bend it in the allowed range, maintaining the compression forces uniform throughout the component in order to maintain proper electrical connectivity.

Test Socket BGA component high performance test socket